Array imaging system having discrete camera modules and method for manufacturing the same

ABSTRACT

An array imaging apparatus having discrete camera modules is disclosed. In one embodiment, the apparatus comprises a substrate; and heterogeneous camera modules attached to the substrate and in a geometric relationship with each other, the heterogeneous camera modules having a substantially similar photometric response.

RELATED APPLICATIONS

This patent arises from a continuation of U.S. application Ser. No.16/730,597 (now U.S. Pat. No. 11,356,587), titled “An Array ImagingSystem Having Discrete Camera Modules and Method for Manufacturing theSame,” filed Dec. 30, 2019, which is a continuation of U.S. patentapplication Ser. No. 14/750,772 (Now U.S. Pat. No. 10,523,854), titled“An Array Imaging System Having Discrete Camera Modules and Method forManufacturing the Same,” filed on Jun. 25, 2015, both of which arehereby incorporated by reference in their entireties.

FIELD OF THE INVENTION

Embodiments of the present invention relate to the field of cameras;more particularly, embodiments of the present invention relate tomulti-camera arrays having discrete camera modules.

BACKGROUND OF THE INVENTION

The camera in a mobile phone or tablet platform is typically referred toas a camera module. Traditionally, a camera module consists of a singlesensor and a single lens producing a single image of the scene with eachexposure. FIG. 1 illustrates a camera module that consists of an imagesensor (typically CMOS) mounted to a substrate, a lens and a lensholder. The CMOS sensor can be in a pre-packaged form or a bare-diewhich is then bonded to the substrate in a highly clean environment.Once the sensor is attached to the substrate, the lens holder isprecisely placed such that the optical axis of the lens matches withcenter of active sensor array. Once the lens holder is in place andglued, the lens is attached to the lens holder and threaded in. Thefocal position of the lens is adjusted in order to maximize the modulemodulation transfer function (MTF) across various field positions and acouple of object positions. The factories manufacturing the camerasmodule have finely tuned this process and are able to consistentlyproduce high quality modules with higher than 90% yield and excellentthroughput. The net result is that the camera module has high mechanicaltolerances and consistent optical performance.

The camera-array or multi-camera system is a new area of development inimaging. Such systems can simultaneously capture multiple views of thescene using multiple lenses. Having multiple views of the same sceneenables the system to extract depth of the objects in the scene usingthe parallax between the various views. In the past, a camera-arraymodule was built using a single custom-designed CMOS sensor on amonolithic piece of silicon. These are custom-designed sensors includesub-arrays, with each sub-array having their own control and read-outcircuits. FIG. 2 shows a multi-camera array using a monolithic sensorand a single lens with lens-lets to match each sub-array unit in thesensor.

There are a number of problems associated with manufacturing an arraycamera. First, in order to build a camera-array module, the array sensoris assembled with a lens-array which is a single unit with multiplelenses. Each sub-array has its own lens-let such that the optical centerof the sub-array and lens-let are matched. In order for the all thesub-modules to have consistently good focus, the factories have todevelop new ways to focus the lens and test the modulation transferfunction (MTF) of each sub-camera module. One of the methods for thispurpose used is referred to as “active alignment,” in which the lensposition is actively controlled in the x, y and z directions and whenthe correct position is found the lens is glued in-situ and snap-cured.This process requires high precision stations and the takessignificantly more time compared to a traditional module assembly step,thus reducing overall assembly line through-put. The array module yieldis also low since the sub-par performance of a sub-array in the entirearray will force the entire module to be rejected. There is limitedscope to re-work a selected sub-array given how the module is puttogether. As a result, the array module assembly requires new capitalequipment and changes to established module assemblies work flow, whichadds to the module cost.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the invention, which, however, should not be taken tolimit the invention to the specific embodiments, but are for explanationand understanding only.

FIG. 1 illustrates a camera module.

FIG. 2 shows a multi-camera array using a monolithic sensor and a singlelens.

FIG. 3 illustrates one embodiment of a multi-camera array withindependent camera modules attached to a substrate.

FIG. 4 illustrates one embodiment of a multi-camera array withindividual camera sensors attached to a substrate along with a singlelens holder.

FIG. 5 is a flow diagram of one embodiment of a process for assembling amulti-camera system using individual camera modules.

FIG. 6 is a flow diagram of another embodiment of a process forassembling a multi-camera system using individual camera modules.

FIG. 7 illustrates a portable image capture device.

DETAILED DESCRIPTION OF THE PRESENT INVENTION

In the following description, numerous details are set forth to providea more thorough explanation of the present invention. It will beapparent, however, to one skilled in the art, that the present inventionmay be practiced without these specific details. In other instances,well-known structures and devices are shown in block diagram form,rather than in detail, in order to avoid obscuring the presentinvention.

A multi-camera array and method for building the same are described. Inone embodiment, the array camera system are built using discrete off theshelf camera modules. In one embodiment, a multi-camera system is builtusing a collection of individual mobile phone camera modules to form amulti-camera platform. In one embodiment, this is enabled through theuse of component pick-and-place machines and reflowable materials usingin camera-optics.

In one embodiment, the multi-camera array comprises a substrate; andmultiple, heterogeneous camera modules attached to the substrate and ina geometric relationship with each other. The heterogeneous cameramodules have a substantially similar photometric response. This may bein terms of the passive disparity and depth, white balance, sharpness,gamma, and noise level.

In one embodiment, each camera module comprises a sensor, lens, a lensholder, and an infra-red (IR) filter. In one embodiment, the cameramodules are reflowable camera modules. In one embodiment, the cameramodules are soldered to the substrate using surface mount technology(SMT). In one embodiment, the substrate comprises a stiffened printedcircuit board (PCB) with a low coefficient of expansion material. In oneembodiment, the substrate comprises a ceramic substrate. In oneembodiment, the camera modules are synchronized with each other. Invarious embodiments, the camera modules are synchronized with each otherusing a synchronization pin of each camera module, a frame-synch pin ofeach module, or a general purpose input/output (GPIO) pin, or softwarecommands sent to the camera modules over a control bus (e.g., an I2Cbus).

FIG. 3 illustrates a multi-camera system. Referring to FIG. 3 ,independent, heterogeneous camera modules 300 ₁₋₅ are attached to aprinted circuit board (PCB) (i.e., a substrate). Specifically, cameramodule 300 ₁, 300 ₂, 300 ₄ and 300 ₅ are the same and different fromcamera module 300 ₃. In one embodiment, camera modules 300 ₁₋₅ arediscrete off-the-shelf camera modules, thereby obviating the need for acustom imaging array sensors and custom array optics. In one embodiment,each of camera modules 300 _(1_5) includes a sensor, a filter (e.g., aninfra-red (IR) filter), a lens, and a lens holder. For example, cameramodules 300 ₂ includes sensor 310 (e.g., a Complementary Metal OxideSilicon (CMOS) sensor), IR filter 311, lens 312 with a lens holderholding IR filter 311 and lens 312 in place.

In one embodiment, the camera sensors of the camera modules in the arrayare different. In one embodiment, all the camera sensors could be RGBsensors, while one camera sensor is a Bayer pattern camera sensor. Inanother embodiment, one or more of the camera sensors are monochromaticsensors (e.g., R, G, or B). In other embodiments, all the sensors areall the same type (e.g., RGB) but at least one is bigger than the other.In another embodiment, one of the camera sensors has a short focallength and is used as a wide angle camera, while another camera sensorhas a large focal length and is used as a telephoto camera.

In one embodiment, the multi-camera system of FIG. 3 is characterized bythe geometric relationship between each camera module with respect tothe rest of the cameras in the multi-camera system. In one embodiment,the focal length of the homogenous camera modules is close to identical.Once these parameters and geometric relationships are characterized andcalibrated, the system should remain calibrated.

In one embodiment, to create the multi-camera assembly, standardassembly processes are used.

In one embodiment, the multi-camera system, such as shown in FIG. 3 ,has three characteristics. First, the geometric relationship between themultiple apertures is reliable and repeatable, with a tolerance of 500microns and that this geometric relationship can be held rigidly overthe long term. Second, the photometric response of the multipleapertures are consistently close, or substantially the same. Third, themultiple camera's image can be synchronized with respect to each other.

In one embodiment, to ensure the geometric relationship between thesub-arrays remains the same, the substrate to which the camera modulesare attached is rigid. This will maintain the integrity of the geometryof the array. In one embodiment, the substrate is a PCB with stiffenerswith a low coefficient of expansion material, which are available today.In another embodiment, the substrate is a ceramic substrate and a lowcoefficient of expansion.

In one embodiment, the camera modules are attached to the substrateusing pick and place machines and surface-mounted-technology. In oneembodiment, the off-the-shelf camera modules are soldered onto a PCBusing SMT methods. Once the camera modules are soldered on the printedcircuit board, the stiffened PCBs or ceramic substrates help maintainthe geometric relationship between the various camera modules in themulti-camera arrangement.

In one embodiment, the camera modules used in the multi-camera systemhave a consistent photometric response.

In one embodiment, the camera modules in the multi-camera system aresynchronized. the synchronization occurs using an externalsynchronization pin of the camera sensor, which establishes the temporalrelationship between the various modules. In one embodiment,synchronization occurs by the use of a dedicated Frame-Sych pin. Inanother embodiment, synchronization occurs by the use of ageneral-purpose I/O (GPIO) pin on the camera sensor configured as asynchronization pin. Such a GPIO pin once configured as asynchronization pin is equivalent to having a dedicated Frame-Sync pin.In yet another embodiment, software commands are used and sent to thecamera modules over a control bus (e.g., an I2C bus) in order tosynchronize their operation.

The multi-camera systems described herein can be assembled in a numberof ways. In one embodiment, the camera modules are placed accurately ona stiff PCB and held in place using sockets or other special retainers.An example of the retainers are shown in as shown in FIG. 3 . Theretainers can take many forms. If the fundamental unit is camera modulewith solder-bumps at the bottom, then the camera modules are directlysoldered onto the stiffened PCB and that is what holds them to thestiffened PCB. In another instance, the bare sensor die is attached tothe PCB and wire-bonded to the substrate. Once this has been done, thelens holder and lens are attached to the CMOS sensor and flash-glued inplace. In a third instance, if the camera module has a flexible-cablecoming out the module, then the module is secured to a specific place onthe PCB using a custom mechanical holder or an enclosure, therebyholding the module in a specific orientation. This enclosure can beattached to the PCB using solder-bonding.

In another embodiment, the sensors are first attached to the PCB in aclean room using SMT techniques and once the sensors are in place, anindividual lens holder is placed over them and the lens are attached andadjusted for maximum performance. In one embodiment, adjustments includemaking the lens focus is to focus to the same focal distance. The lensfocus adjustment also delivers similar MTF across all the field-point ofthe image.

In one embodiment, power and/or gating is used to control powerconsumption of the individual camera modules. A controller, based onwhether one or more camera modules is idle and/or not needed to be usedin the near future, is able to control clocking and/or power to theindividual modules.

FIG. 4 illustrates such a multi-camera system. Referring to FIG. 4 ,sensors 410 (e.g., CMOS sensors) are attached to PCB 401. After sensors410 are attached, a single lens holder 402 is attached to PCT 401. Lensholder 402 holds lens array 403 in place such that the individual lens(e.g., lens 402) and IR filters (e.g., IR filter 411) are positioned andheld in place over their respective sensor (e.g., sensor 410).

In one embodiment, the camera sensors are packaged sensor parts, like inchip-scale-packages. These chip-scale packaged sensors are attached tothe PCB via SMT and then the lens holder and lens are attached to thePCT. The advantage of using chip scale package is that it eliminates theneed for extremely high level (class10) clean rooms.

In one embodiment, the camera modules are reflowable camera moduleswhich are designed to withstand the reflow-heat-profile. In oneembodiment, each of the reflowable camera modules is a complete camerashipped in tape-and-reel and thus can be attached to the PCB as otherpassive components. In one embodiment, for assembling the camera array,the entire camera module is placed on the PCB (substrate) usingpick-and-place machines. The camera modules along with other surfacemounted components are held in place with solder flux and the wholeboard is put in a SMT oven to cause the reflow process to occur.

In another embodiment, rather than using individual lens holders, asingle lens holder and a single array lenses unit is used. In this case,the individual lens focal lens is adjusted, if necessary, using thethickness and properties of the infra-red filter. The thicker the IRfilter, the more it pushes out the focal length. Therefore, in oneembodiment, a thicker IR filter is added to lenses whose focal lengthcomes in short to match them with the longest focal length lens. Afterthe IR filter is added, the focal length can match that of the longestlenslet focal length. In one embodiment, to make the adjustment is usingthe thickness and properties of the filter, assume that ideally all thelenses should focus 1 mm distance from the exit pupil of the lens, andassume that the lens array has 12 lens-lets, arranged in a 4×3arrangement. Assume that each lens in the array can have an error infocus distance which ranges from +100 microns to −100 microns making thefocal distance to range from 900 microns to 1.1 mm. Since there is nofreedom to individually move each lens in the lens array, a separatepiece of glass that is matched with the focus-error of that lenslet isused so that the corrected focus length is 1.2 mm for all the lenlets inthe array. Each sensor/lenlet pair needs an IR cut-filter and hence thefocus-error can be adopted and the IR cut is provided using this opticalelement.

FIG. 5 is a flow diagram of one embodiment of a process for assembling amulti-camera system using individual camera modules. Referring to FIG. 5, the process begins by holding a plurality of heterogeneous cameramodules in a geometric relationship using a retainer having a pluralityof openings (processing block 501). In one embodiment, the cameramodules are reflowable camera modules that are able to go through an SMTreflow process without damaging the camera modules. In one embodiment,the camera module comprises a sensor, lens, a lens holder, and aninfra-red (IR) filter. In one embodiment, the camera sensors of theplurality of camera modules are part of chip-scale packages.

Next, process includes maintaining, or holding, the position of thecamera modules to a substrate (e.g., printed circuit board (PCB), aceramic substrate, etc.) with solder flux (processing block 502). In oneembodiment, the substrate comprises a stiffened printed circuit board(PCB) with a low coefficient of expansion material. In one embodiment,the substrate comprises a ceramic substrate.

While maintaining the position of the camera modules, the process placesthe substrate in a surface mount technology (SMT) oven to reflow thesolder flux to affix the camera modules to a substrate (processing block503).

FIG. 6 is a flow diagram of another embodiment of a process forassembling a multi-camera system using individual camera modules.Referring to FIG. 6 , the process begins by attaching a plurality ofheterogeneous camera sensors for a plurality of cameras to a substrateusing SMT, with camera sensors being in a predetermined geometricrelationship (processing block 601). In one embodiment, the camerasensors are part of chip-scale packages. In one embodiment, thesubstrate comprises a stiffened printed circuit board (PCB) with a lowcoefficient of expansion material. In one embodiment, the substratecomprises a ceramic substrate.

Next, the process places at least one lens holder over one or morecamera sensors of the plurality of camera sensors (processing block 602)and attaches the at least one lens holder to the substrate (processingblock 603). In one embodiment, placing at least one lens holder over oneor more camera sensors of the plurality of camera sensors comprisesplacing a lens holder over each camera sensor of the plurality of camerasensors. In one embodiment, placing at least one lens holder over one ormore camera sensors of the plurality of camera sensors comprises placinga single lens holder over the plurality of camera sensors, the singlelens holder containing a lens and an infra-red (IR) filter for eachcamera sensor of the plurality of camera sensors.

Once the lens holder(s) is attached, the process adjusts individual lensfocal length for each of the cameras associated with each of theplurality of camera sensors (processing block 604). In one embodiment,adjusting lenses comprises adjusting individual lens focal length isperform by using the thickness and properties of the infra-red filter.

The techniques described herein enables building camera arrays usingwell known methods which will lead to lower-cost and better time tomarket. Furthermore, the techniques for building multi-camera systemshave numerous advantages over the array-camera approach described above.First, these techniques allow more freedom in how the system is set andconfigured using the same basic building blocks. Second, the techniquesallow camera module integrators to use the traditional factory stationto build camera arrays or multi-camera system. Third, the yield of thisapproach can be as high as traditional cameras assembly since it usesthe traditional assembly stations and assembly know-how. Fourth, sincethese module are independent of each other, a defective module can bereworked and replaced, as opposed to defects in a single sub-array inthe array-silicon which implies that the whole module is lost, therebyresulting in low yields and high unit cost. Fifth, the techniquesdescribed herein natively comes with power-gating and clock gating—afeature which is quite expensive to build into a single piece ofsilicon. Sixth, the techniques described herein allow mixing andmatching different sensors with completely different specifications andeven different suppliers. For example, one of the modules could be a8M-pixel camera with a 1.1 micron pixel, while the other modules couldbe 2Mega-pixel with a 1.4 micron pixel. This degree of freedom is veryvaluable to original equipment manufacturers (OEMs).

FIG. 7 illustrates a portable image capture device 100 in accordancewith one implementation. The imaging device 100 houses a system board 2.The board 2 may include a number of components, including but notlimited to a camera array as described above, a processor 4, and atleast one communication package 6. The communication package may becoupled to one or more antennas 16. The processor 4 is physically andelectrically coupled to the board 2.

Depending on its applications, image capture device 100 may includeother components that may or may not be physically and electricallycoupled to the board 2. These other components include, but are notlimited to, volatile memory (e.g., DRAM) 8, non-volatile memory (e.g.,ROM) 9, flash memory (not shown), a graphics processor 12, a digitalsignal processor (not shown), a crypto processor (not shown), a chipset14, an antenna 16, a display 18 such as a touchscreen display, atouchscreen controller 20, a battery 22, an audio codec (not shown), avideo codec (not shown), a power amplifier 24, a global positioningsystem (GPS) device 26, a compass 28, an accelerometer (not shown), agyroscope (not shown), a speaker 30, a camera array 32, a microphonearray 34, and a mass storage device (such as hard disk drive) 10,compact disk (CD) (not shown), digital versatile disk (DVD) (not shown),and so forth). These components may be connected to the system board 2,mounted to the system board, or combined with any of the othercomponents.

The camera array may be coupled to an image chip 36, such as an imagingsignal processor and to the processor 4, either directly or through theimage chip. The image chip may take a variety of different forms, suchas a graphics co-processor, or a separate dedicated imaging managementmodule. Such a module or device may comprise logic, algorithms, and/orinstructions operative to capture, process, edit, compress, store,print, and/or display one or more images. These processes may includede-noising, image recognition, image enhancement and other processesdescribed herein. In some embodiments, the imaging management module maycomprise programming routines, functions, and/or processes implementedas software within an imaging application or operating system. Invarious other embodiments, the imaging management module may beimplemented as a standalone chip or integrated circuit, or as circuitrycomprised within the processor, within a CPU, within a graphics chip orother integrated circuit or chip, or within a camera module.

The communication package 6 enables wireless and/or wired communicationsfor the transfer of data to and from the video device 100. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication package 6 may implementany of a number of wireless or wired standards or protocols, includingbut not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16family), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+,HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, Ethernetderivatives thereof, as well as any other wireless and wired protocolsthat are designated as 3G, 4G, 5G, and beyond. The video device 100 mayinclude a plurality of communication packages 6. For instance, a firstcommunication package 6 may be dedicated to shorter range wirelesscommunications such as Wi-Fi and Bluetooth and a second communicationpackage 6 may be dedicated to longer range wireless communications suchas GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.

Cameras 32 may include all of the components of the camera or shareresources, such as memory 8, 9, 10, processing 4 and user interface 12,20, with other video device components and functions. The processor 4 iscoupled to the camera and to memory to receive frames and produceenhanced images. In one embodiment, cameras 32 include an image capturesensor(s) and color filter array describe above. In one embodiment,cameras 32 also include an image processing system, as described above.

In various implementations, the image capture device 100 may be a videocamera, a digital single lens reflex or mirror-less camera, a cellulartelephone, a media player, laptop, a netbook, a notebook, an ultrabook,a smartphone, a wearable device, a tablet, a personal digital assistant(PDA), an ultra mobile PC, or a digital video recorder. The imagecapture device may be fixed, portable, or wearable. In furtherimplementations, the image capture device 100 may be any otherelectronic device that records a sequence of image frames and processesdata.

In a first example embodiment, a multi-camera apparatus comprises asubstrate, and heterogeneous camera modules attached to the substrateand in a geometric relationship with each other, the heterogeneouscamera modules having a substantially similar photometric response.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the camera modules are reflowablecamera modules.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the camera modules are solderedto the substrate using surface mount technology (SMT).

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the substrate comprises astiffened printed circuit board (PCB) with a low coefficient ofexpansion material.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the substrate comprises a ceramicsubstrate.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the camera modules aresynchronized with each other using a frame-sych pin of each module.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the camera modules aresynchronized with each other using a general purpose input/output (GPIO)pin.

In another example embodiment, the subject matter of the first exampleembodiment can optionally include that the camera modules aresynchronized with each other using software commands sent to the cameramodules over a control bus (e.g., an I2C bus).

In a second example embodiment, q method for assembling a multi-camerasystem using individual camera modules comprises holding a plurality ofheterogeneous camera modules in a geometric relationship using aretainer having a plurality of openings, the camera modules beingreflowable camera modules, maintaining position of the camera moduleswith solder flux, and placing the board in a surface mount technology(SMT) oven to reflow the solder flux to affix the camera modules to asubstrate.

In another example embodiment, the subject matter of the second exampleembodiment can optionally include that the substrate comprises astiffened printed circuit board (PCB) with a low coefficient ofexpansion material.

In another example embodiment, the subject matter of the second exampleembodiment can optionally include that the substrate comprises a ceramicsubstrate.

In another example embodiment, the subject matter of the second exampleembodiment can optionally include that the camera module comprises asensor, lens, a lens holder, and an infra-red (IR) filter.

In another example embodiment, the subject matter of the second exampleembodiment can optionally include that the camera sensors of theplurality of camera modules are part of chip-scale packages.

In a third example embodiment, a method for assembling a multi-camerasystem using individual camera modules comprises attaching a pluralityof heterogeneous camera sensors for a plurality of cameras to asubstrate using SMT, where the plurality of heterogeneous camera sensorsare in a predetermined geometric relationship, placing at least one lensholder over one or more camera sensors of the plurality of camerasensors, attaching the at least one lens holder to the substrate, andadjusting individual lens focal length for each of the camerasassociated with each of the plurality of camera sensors.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that placing at least one lens holderover one or more camera sensors of the plurality of camera sensorscomprises placing a lens holder over each camera sensor of the pluralityof camera sensors.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that placing at least one lens holderover one or more camera sensors of the plurality of camera sensorscomprises placing a single lens holder over the plurality of camerasensors, the single lens holder containing a lens and an infra-red (IR)filter for each camera sensor of the plurality of camera sensors.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that adjusting individual lens focallength comprise adjusting individual lens focal length is perform byusing the thickness and properties of the infra-red filter.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that the camera sensors are part ofchip-scale packages.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that the substrate comprises astiffened printed circuit board (PCB) with a low coefficient ofexpansion material.

In another example embodiment, the subject matter of the third exampleembodiment can optionally include that the substrate comprises a ceramicsubstrate.

Some portions of the detailed descriptions set forth above are presentedin terms of algorithms and symbolic representations of operations ondata bits within a computer memory. These algorithmic descriptions andrepresentations are the means used by those skilled in the dataprocessing arts to most effectively convey the substance of their workto others skilled in the art. An algorithm is here, and generally,conceived to be a self-consistent sequence of steps leading to a desiredresult. The steps are those requiring physical manipulations of physicalquantities. Usually, though not necessarily, these quantities take theform of electrical or magnetic signals capable of being stored,transferred, combined, compared, and otherwise manipulated. It hasproven convenient at times, principally for reasons of common usage, torefer to these signals as bits, values, elements, symbols, characters,terms, numbers, or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. Unlessspecifically stated otherwise as apparent from the following discussion,it is appreciated that throughout the description, discussions utilizingterms such as “processing” or “computing” or “calculating” or“determining” or “displaying” or the like, refer to the action andprocesses of a computer system, or similar electronic computing device,that manipulates and transforms data represented as physical(electronic) quantities within the computer system's registers andmemories into other data similarly represented as physical quantitieswithin the computer system memories or registers or other suchinformation storage, transmission or display devices.

The present invention also relates to apparatus for performing theoperations herein. This apparatus may be specially constructed for therequired purposes, or it may comprise a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program may be stored in a computerreadable storage medium, such as, but is not limited to, any type ofdisk including floppy disks, optical disks, CD-ROMs, andmagnetic-optical disks, read-only memories (ROMs), random accessmemories (RAMs), EPROMs, EEPROMs, magnetic or optical cards, or any typeof media suitable for storing electronic instructions, and each coupledto a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems may be used with programs in accordance with the teachingsherein, or it may prove convenient to construct more specializedapparatus to perform the required method steps. The required structurefor a variety of these systems will appear from the description below.In addition, the present invention is not described with reference toany particular programming language. It will be appreciated that avariety of programming languages may be used to implement the teachingsof the invention as described herein.

A machine-readable medium includes any mechanism for storing ortransmitting information in a form readable by a machine (e.g., acomputer). For example, a machine-readable medium includes read onlymemory (“ROM”); random access memory (“RAM”); magnetic disk storagemedia; optical storage media; flash memory devices; etc.

Whereas many alterations and modifications of the present invention willno doubt become apparent to a person of ordinary skill in the art afterhaving read the foregoing description, it is to be understood that anyparticular embodiment shown and described by way of illustration is inno way intended to be considered limiting. Therefore, references todetails of various embodiments are not intended to limit the scope ofthe claims which in themselves recite only those features regarded asessential to the invention.

1. (canceled)
 2. An apparatus comprising: a processor; a memoryelectrically coupled to the processor; and a multi-camera systemelectrically coupled to the processor, the multi-camera systemincluding: a printed circuit board substrate, a first camera including afirst sensor, a first lens, a first filter, a first lens holder, and afirst lens housing, the first camera coupled to the printed circuitboard substrate, the first lens holder configured to mount the firstlens relative to the first sensor, and a second camera disposed relativeto the first camera in a fixed geometric relationship, the second cameraincluding a second sensor, a second lens, a second filter, a second lensholder, and a second lens housing, the second camera coupled to theprinted circuit board substrate, the second lens housing configured tomount the second lens relative to the second sensor, one of the firstlens housing or the second lens housing is physically larger than theother of the first lens housing or the second lens housing.
 3. Theapparatus of claim 2, further comprising a mechanical holder coupled tothe first and second cameras and configured to provide the fixedgeometric relationship.
 4. The apparatus of claim 2, wherein one of thefirst or the second cameras is a telephoto camera and the other of thefirst or the second cameras is a wide-angle camera.
 5. The apparatus ofclaim 2 further comprising a first flexible cable configured toelectrically couple the first camera to the substrate and a secondflexible cable configured to electrically couple the second camera tothe substrate.
 6. The apparatus of claim 2, wherein the first and thesecond cameras are configured to be synchronized with each other.
 7. Theapparatus of claim 2, further comprising a communication packageconfigured to enable transfer of data to and from the apparatus bywireless and/or wired communications.
 8. The apparatus of claim 2wherein the first or the second camera further comprises an imageprocessing component.
 9. The apparatus of claim 2, wherein at least oneof the first or second lens holders is placed over one or more of thefirst or second camera sensors, and wherein the at least one of thefirst or second lens holders is attached to the substrate.
 10. Theapparatus of claim 2, wherein the processor is configured to controlpower to one or more of the first camera or the second camera.
 11. Theapparatus of claim 10, wherein power is controlled based on whether oneor more of the first camera or the second camera is idle.
 12. Theapparatus of claim 10, wherein power is controlled based on whether oneor more of the first camera or the second camera is not needed to beused in the near future.
 13. The apparatus of claim 2, furthercomprising an image chip, wherein the first and second cameras areelectrically coupled to the image chip and to the processor, eitherdirectly or through the image chip.
 14. The apparatus of claim 13,wherein the image chip comprises an imaging signal processor, a graphicscoprocessor, or a dedicated imaging management module.
 15. The apparatusof claim 14, wherein the dedicated imaging management module compriseslogic, algorithms, and/or instructions operative to capture, process,edit, compress, store, print, and/or display one or more images.
 16. Theapparatus of claim 14, wherein the dedicated imaging management moduleis configured to provide de-noising, image recognition, and/or imageenhancement processes.
 17. The apparatus of claim 14, wherein thededicated imaging management module comprises programming routines,functions, and/or processes implemented as software within an imagingapplication or operating system.
 18. The apparatus of claim 14, whereinthe dedicated imaging management module comprises a standalone chip, anintegrated circuit, or circuitry within the processor, a CPU, a graphicschip, or the first or second cameras.